Each device has a unique top mark used to identify the vendor, device name, part number, manufacturing date code, lot number, and Pin 1 orientation.
The top-mark layout is shown below.
Part Number Format
The part number includes: vendor, product category, device number, package type, material type, product grade (operating temperature), Mask ROM version, and IC revision.
Its format can be written as J M B 5 8 5 - Q H B A 0 A, mapped to fields a b c d e f g h, and divided into Section I and Section II:
| Section | Field | Characters | Meaning |
|---|---|---|---|
| Section I | a | JM |
Brand name |
| Section I | b | B |
Product category |
| Section I | c | 585 |
Device number |
| Section II | d | Q |
Package type |
| Section II | e | H |
Material and grade |
| Section II | f | B |
Internal bonding type |
| Section II | g | A0 |
Mask ROM version |
| Section II | h | A |
IC revision |
| Field | Length | Definition | Code(s) | Notes |
|---|---|---|---|---|
| a (JM) | 2 digits | Brand name | JM | Vendor is JMicron |
| b (B) | 1 digit | Product category | B | B = Bridge, S = SOC |
| c (585) | 3 digits | Device number | 585 | Combined with brand and category to form device name JMB585 |
| d (Q) | 1 digit | Package type | B, L, Q, T | B = BGA, L = LQFP, Q = QFN, T = TQFP |
| e (H) | 1 digit | Material and grade | G, H, I, J | G: Gold wire, RoHS, halogen-free, Ta: 0 to 70°C;H: Copper wire, RoHS, halogen-free, Ta: 0 to 70°CI: Gold wire, RoHS, halogen-free, Ta: -40 to 85°C;J: Copper wire, RoHS, halogen-free, Ta: -40 to 85°C |
| f (B) | 1 digit | Internal bonding type | A, B, C, … | Internal bonding code |
| g (A0) | 2 digits | Mask ROM version | A0, A1, A2, …; B0, B1, B2, …; Z0 |
A* means A-series version; B* means B-series version; Z0 means no Mask ROM |
| h (A) | 1 digit | IC revision | A, B, C, … | IC version code |